Technology miniaturisation is moving fast in the audio world as surface mount speakers and tiny microphones mean electronic devices are still shrinking as performance expands. SonicEdge Ltd creates innovative audio components designed to fit in incredibly small spaces.
The company’s products use the same silicon technology found in miniature devices using the same reliable silicon technology powering billions of smart devices worldwide. Whether it’s smartphones or cars, these tiny components can be used to create high-quality audio products on a large scale.
Like most technology, the components that SonicEdge produces improve with each generation, doubling the amount of sound output from the same tiny space every two years. By combining multiple audio functions into single, compact packages, Sonic Edge manages to improve performance while pushing what’s possible in audio technology, producing solutions that offer high sound quality with groundbreaking features in ever-smaller designs.
SonicEdge will announce the launch of SonicTwin at CES 2025. SonicTwin is described as the world’s smallest integrated speaker-microphone in a single package, designed specifically for use in True Wireless Stereo earbuds and headphones. Measuring a minuscule 8 x 4 x 1mm, the SonicTwin blends innovative sound generation and sensing capabilities, which the company claims set a new benchmark in compact audio innovation.
Powered by SonicEdge’s patented modulated ultrasound technology, SonicTwin eliminates traditional mechanical vibrations, enabling seamless integration of speakers and sensors. This breakthrough produces exceptionally high Sound Pressure Levels in a tiny form factor, changing what’s possible for TWS earbuds and wearables like fitness watches. Engineering samples of the new SonicTwin will become available in 2025 and should begin to appear in consumer audio products in 2026.
“SonicTwin is a game-changer,” claims Moti Margalit, CEO and founder of SonicEdge. “It unlocks immersive, integrated audio solutions and sets a new standard for wearables and beyond. Its ultra-compact size enables true in-ear canal integration, providing unmatched performance, comfort, and active noise cancellation (ANC) for TWS earbuds and headphones. With SonicTwin, manufacturers can design smaller devices or allocate more space for larger batteries, offering unprecedented freedom in product design.”
Traditional active noise cancelation systems found in many wireless earbuds can often suffer from what is known as “can sound syndrome” where users experience a hollow, tunnel-like sound quality like hearing audio through a tin can. This phenomenon occurs because of the acoustic resonance produced in the enclosed space of the earbud housing and interference between closely placed speakers and microphones
“SonicTwin marks the end of ‘can sound syndrome’,” said Ari Mizrachi, CTO and co-founder of SonicEdge. “Our modulated ultrasound technology replaces traditional voice coils, resulting in higher efficiency, superior sound quality, and co-packaged sensors—all in a size once thought impossible.”
SonicTwin transforms the production process. By reducing the number of components required, it minimizes complexity on the production line, accelerating the time it takes to bring a product to market. As part of SonicEdge’s MEMS-based product portfolio, SonicTwin points the way toward the next-generation of integrated speaker-sensor solutions that can be used to power applications in sectors like environmental awareness and health monitoring.
